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Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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Indium Experts to Present at Electronics in Harsh Environments SMTA Conference
ndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium...
epoxySet Launches EC-1015HP - High Temperature, Crack Resistant Epoxy Potting
epoxySet introduces the EC-1015HP epoxy potting compound. This heat cure system is designed for temperature cycling from -55 to 180°C with...
Breaking News: Relive the Experience: Real Time with… IPC APEX EXPO 2024 Show & Tell Magazine
You came, you saw, and you experienced the magic of IPC APEX EXPO 2024. Now you get to relive the many memories and experiences in the pages of Real...
Emerald Technologies Acquires Optimum
Emerald Technologies announced its acquisition of Optimum Design Associates, Inc. (Optimum), a leading electronic design and engineering services company. Terms were not...
Neways Adds Saab to Its Blue-chip Customer Portfolio
Neways, the global innovator in mission-critical technology for leading semicon, connectivity and smart mobility companies, has onboarded Saab as new...
AEye Announces Partnership with Leading Automotive Electronics and Vision Solutions Provider, LITEON
AEye, Inc., a global leader in adaptive, high-performance lidar solutions, today announced that the non-binding Letter of Intent (“LOI”)...
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Star Wars and Disney: ‘Spinning the Script’ With Paul Bailey
May 13, 2024 | I-Connect007 Editorial Team
Paul Bailey has quite a story to tell. The current vice president at AOA, and former principal concept technical director for Walt Disney Imagineering gave the opening keynote speech at IPC APEX EXPO 2024. He delved into some of the technological marvels he’s been involved with throughout his career, particularly with Star Wars: Galaxy’s Edge, the new Star Wars experience at Disneyland and Walt Disney World.
IPC Raymond E. Pritchard Hall of Fame Award: Pierre-Jean Albrieux
May 10, 2024 | Marcy LaRont, PCB007 Magazine
Congratulations to Pierre-Jean Albrieux, who received the 2024 IPC Raymond E. Pritchard Hall of Fame Award. The award is given to individuals in recognition of the highest level of achievement, extraordinary contributions, and distinguished service to IPC and toward the advancement of the industry, including helping to create a spirit of mutual esteem, respect, and recognition among members consistent with the goals and mission of IPC.
MORE ARTICLES
Nolan’s Notes: Coming to Terms With AI
May 7, 2024 | Nolan Johnson, Nolan's Notes
How fast do things move in the world of data analytics? Here’s an example. We’ve been planning this issue on artificial intelligence for the past few months, and, in fact, I had already written this column about a month ago. Then...
The Knowledge Base: A CM’s Perspective on Box Build Practices
April 30, 2024 | Mike Konrad, The Knowledge Base
In the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic...
SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1
April 17, 2024 | Dr. Jennie Hwang, SMT Perspectives and Prospects
In this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and...
Nolan’s Notes: Do More, Get More
April 2, 2024 | Nolan Johnson, Nolan's Notes
This month in SMT007 Magazine, we’re investigating box build, a manufacturing sector so closely adjacent to board assembly that some OEM customers they’re the same thing. To those of us doing this work, we know they’re very...
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- Using AI to Redefine Productivity with Amin Arbabian, Anders Holden, Raj Vora, and Luis Vidal
- Empowering the Smart Factory Era With AI by Joel Scutchfield and Brent Fischthal
- A Glossary of Artificial Intelligence Terms
- Chiplet Architecture for AI Will Create New Demands for Assembly with Arvind Kumar
- The Rise of Collaborative Intelligence in Manufacturing by Jennifer Davis